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Adhesives for Chip Components

[A] SA-series are one-component type epoxy adhesive for Chip/Melf components
PRODUCTS SA-33 P-2 SA-250 series SA-500 series
Application For dispensing Standard type SA-250P = Pin trans
SA-250S = Screen
High Speed dispense Low temp.-cure type
Color Red paste Red paste Red paste
Viscosity 50-70Pa.s (30°C) 45-60Pa.s (25°C) 45-75Pa.s (30°C)
Thixotropic index 5.5 - 7.5 3.0 - 4.5 5.5 - 7.5
Curing condition 130°C × 60sec. 130°C × 80sec. 90°C × 60sec.
Tensile strength ≥40N
Solder resistance ≥15秒
Volume resistivity 1 × 1015Ω · cm 4 × 1013Ω · cm 4 × 1013Ω · cm
Shelf Life 6 months (storing temperature 10°C)
  • 35g Syringe
  • 300g Cartridge
[B] Conductive adhesives with epoxy resin binder as an alternative for soldering process.
PRODUCT LS-110 LS-103
Applications Reliability and fine pitch Low temperature curing
Viscosity (at 25°C) 130 - 150Pa.s 70 - 100Pa.s
Thixotropic index 15 - 25 8 - 14
Curing condition 130°C × 30min. 150°C × 5min. 120°C × 20min. 150°C × 5min.
Thermal conductivity 1.5W/mk 1.5W/mk
Volume resistivity 5.0 × 10-4Ω · cm 10-3Ω · cm
Tensile strength 3Kgf 2Kgf
Glass transition 110°C 110°C
Coefficient of Linear expansion 40ppm (≤Tg) 90ppm ( ≥Tg) 40ppm (≤Tg) 90ppm ( ≥Tg)
Shelf Life 3 months( ≤-15° C) 3 months( ≤-15° C)
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