Application in personal computer
2021-09-28

Packaging purpose


<subtractive>

<BUM >

Plug hole

conductive:

LS-101S

LS-101S

Non conductive:

FP-R130

FP-R130

 Inner layer

Heat curing: 

CCR-232

BM-350

 Packaging material

Adhesive: 

SA series

Conductive glue:

LS-103, LS-109

EMI


Conductive paste

LS-411AW, SW-1100-1, FTU-15


Insulation paste 

CR-18-KT1


Conductive glue:

LS-103, LS-109

Membrane switch


Conductive paste

LS-411AW, SW-1100-1, FTU-15


Resistance: 

FTU-OO-3


Insulation paste:

CR-18 -KT1, UVF-10G (UV curing)

Multilayer PCB

Solder resist

Photo solder resist ink : 

DPR-805K-1000, DPR-805G T16

Heat curing: 

CCR-232CFV, CCR -240GS,
CCR-510

Marking ink

Photo solder resist ink : 

DPR-805MW & CV & RC

Heat curing:

CCR-232W & C


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