Adhesive

Thermosetting adhesive for chip component

These products are one-component type, thermosetting epoxy adhesives designed to temporarily fix chip components on PWB.

They have been used for a long time, especially in the domestic market.


Product

Outline

Colour

Adhesive strength

Soldering resistance

(at 260℃)

Curing condition

SA-33P-2

1 component type,

For dispenser,

High adhesion

Red

≧ 50N

≧ 5sec

130℃×60sec

SA-350

1 component type,

Halogen-free


Red

≧ 40N

≧ 10sec

130℃×60se

SA-500M-1

1 component type,

Low temperature curing


Red

≧ 40N

≧ 10sec

95℃×60sec


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