Adhesive
Thermosetting adhesive for chip component
These products are one-component type, thermosetting epoxy adhesives designed to temporarily fix chip components on PWB.
They have been used for a long time, especially in the domestic market.
Product | Outline | Colour | Adhesive strength | Soldering resistance (at 260℃) | Curing condition |
SA-33P-2 | 1 component type, For dispenser, High adhesion | Red | ≧ 50N | ≧ 5sec | 130℃×60sec |
SA-350 | 1 component type, Halogen-free | Red | ≧ 40N | ≧ 10sec | 130℃×60se |
SA-500M-1 | 1 component type, Low temperature curing | Red | ≧ 40N | ≧ 10sec | 95℃×60sec |